GLASS VACUUM COATING MACHINES
GC-1650/3
Magnetron Sputtering Production Line
Technical
Specification
CONTENT
1. Application
2. Process
description
2.1 Basic design data
2.2 Process sequence
2.3 Technical data
2.4 System utilities
3. Design
and configuration of the system
3.1 Mechanical
parts
3.2 Power
supply system
3.3 Process
control
4. Documentation
5. Acceptance
test
6. Assembly
and commissioning of the system at buyer's site
7. Acceptance
test at buyer's site
8. Warranty
9.
Equipment
and services not supplied by the seller
10.
Equipment
list
10.1.1
Host
machine
10.1.2
Electric
control system
10.1.3
Water
treatment system
10.1.4
Know how
and technical transfer
10.1.5
Spare
parts
10.1.6
Options
1. Application
The continuous horizontal on-line sputtering system model
WGC-1650/3 is designed for coating glass sheets with metallic and compound
layers for the production of reflective glass.
2. Process Description
2.1 Basic design
parameters
2.1.1 Layer specifications
Layer type:
Metallic: Titanium, Chrome, Stainless Steel, Tin, Aluminum,
Copper, etc.
Compound: TiN, TiO2, etc.
Layer thickness: 5-100nm
Transmission: 8-40% at 380-780 nm wavelengths
Deposition temperature: room temperature
2.1.2 Substrate dimensions:
Substrate material: float glass sheets
Available substrate area: 2100×1650mm ( L×W)
Thickness of substrate: 5 to
2.1.3 Capacity:
Substrates per loading : 1 piece (
Cycle time/sheet: 240 sec.
Calculate with 6000 working hours, 90 percent uptime, 95 percent
of pass, the annual capacity is estimate 270,000 SQM.
2.1.4 Deposition uniformity:
Across a sheet
±3% or less within 2100×1650 mm on each side of the substrate.
Batch to Batch
±3% or less within 2100×1650 mm at continuous operation.
2.2 Process sequence:
Step
1: Loading glass sheet (float flat glass
sheet/substrate)
Step
2: Glass sheet is fed into the washing
unit and moved to entry station
Step
3: The entry lock chamber and gate valve 1 open; glass sheet moves into
entry lock chamber; then chamber ( and gate valve 1 ) is closed; then pumped
down to 1 Pa
Step
4: Glass sheet moves into the entry
buffer chamber through gate valve 2
Step
5: The entry hold chamber and the gate valve 3 open, glass sheet moves
into, and then the gate valve 3 is
closed.
Step
6: Glass sheet moves into the sputtering
chambers for coating.
In process of coating Ti, SS and Cr etc, materials can be coated
onto the surface of glass sheet under specified conditions
Step
7: The exit holds chamber and the gate valve 4 open, glass sheet moves
into, and then the gate valve 4 is
closed.
Step
8: Glass sheet moves to exit buffer
chamber after a series of testing for transmittance (T%)
and reflectance (R%)
Step
9: Glass sheet then moved out from exit
buffer chamber into exit lock chamber following the opening of gate valve 5
Step
10: Released to atmosphere pressure, glass
sheet then moved out of exit lock chamber into exit station.
Step
11: Entering into on-line inspection room
for final on line T% & R% testing
Step
12: Glass unloading
2.3 Technical Data
Ultimate pressure after 8 hr pump-down:
Entry lock chamber & vacuum lock chamber: 5×10-1 Pa or below
Buffer Chamber 1 : 3×10-3
Pa or below
Sputtering Chamber: 2×10-3
Pa or below
Buffer Chamber 2 : 3×10-3
Pa or below
Exit lock chamber & vacuum lock chamber: 5×10-1 Pa
or below
2.4 System utilities
Electric power:
-3 phases, 380 V +5%/-10% 50Hz, five wires (
Cooling water specification
-Pressure: 2 to 3
bar
-Water out-let: 0.5 bar below
-Cooling water inlet temperature range: less than 25℃
-Hardness of water:
0.04mg/l (equivalent)
-Electric conductivity: 1000μS/cm
-PH-value: 7.5-8
Compressed air
-Inlet pressure: 5 to 7 bar
-Dew point under pressure max. + 2.5℃
-Free of oil and dust
Nitrogen
For the venting of chambers
-Inlet pressure: max: 1 bar
-Purity: 99.9%
Sputtering gas
-Sputter gas: Argon, Oxygen, Nitrogen
-Purity of sputter gas ≥99.99%
-Inlet pressure: max.2 bar absolute
Ambient requirements
-For temperature at machine and control room: 20℃ to 25℃
-Relative humidity: 70-80%
l Roller disk transportation system on which glass sheet is moved
flexible.
l Double side pumping system for uniform gas pressure
l Special pumping modules for uniform gas-flow distribution over
the target area
l For making some kind of films, the glass sheet maybe moves to
and fro the sputtering chambers.
l Modular design configuration for future expansion
l Chambers with reinforcement ribs
3.1 Mechanical system
introduction
3.1.1 Loading station
-Steel frame and fixture, sizes 2450 mm×2100 mm
-Disk type roller transport system for linear movement of
substrate
3.1.2 On-line high quality washing station
-Four sets of row brush
-Three complete of column brush
-Three sets of cold air knife
-One set of hot air knife
3.1.3 Entry lock Chamber and
vacuum-lock
-Supporting Frame and Vacuum Chamber
-One substrate lock valves (opening: 40 mm×1720 mm)
-Flanges for installation of the pump system, measuring
equipment and gas inlet
-Vacuum Measuring Equipment: ZDR-1 105 to 10-1 Pa
thermal Priani vacuum gauge
-One sight window
-Roughing Pump Station
Roots pump: ZJP-2200
1 set
Piston pump: H-150
1 set
Rotary pump: 2X-70
1 set
3.1.4
Entry Buffer Chamber
-Steel vacuum chamber
-One substrate lock valves (opening: 40mm×1720mm)
-Pumping System
Diffusing pump: K-400
2 sets
Piston pump: H-150
1 set
-Vacuum Measuring Equipment: ZDF-3 105 to 10-1Pa
thermal Pirani and 10 to 10-6 Pa ion
vacuum gauge.
-One sight window
3.1.5
Entry hold chamber
-Steel vacuum chamber
-One substrate lock valves (opening: 40mm×2350mm)
-Flanges for installation of the pump system, measuring
equipment
-Vacuum Measuring Equipment-One sight window
-Pump system
Diffusion pump: K-400 4
sets
3.1.6 Sputtering chamber
-Steel vacuum chamber
There are
one sputtering chamber installed with three cathodes. So if you making
multi-layer films, the different cathode could not working
in the mean time. You have to run them alternatively.
-Pumping System:
Piston pump: H-150
1 sets
-Vacuum Measuring Equipment: ZDK-1 10 to 10-6 Pa ion
vacuum gauge
-Process gas supply system：
Mass Flow
Controller: F07A 2 sets
-One sight window
3.1.7
Exit hold chamber
-Steel vacuum chamber
-One substrate lock valves (opening: 40mm×2350mm)
-Flanges for installation of the pump system, measuring
equipment
-Vacuum Measuring Equipment-One sight window
-Pump system
Diffusion pump: K-400
4 sets
3.1.8 Exit Buffer Chamber
-Steel vacuum chamber
-Pumping System:
Diffusing pump: K-400
2 sets
Piston pump: H-150 1
set
-Vacuum Measuring Equipment：ZDF-3
105 to 10-1Pa thermal Pirani
and 10 to 10-6 Pa ion vacuum gauge
- One sight window
3.1.9 Entry lock Chamber and
vacuum-lock
-Supporting Frame and Vacuum Chamber
-One substrate lock valves (opening: 40mm×2350mm)
-Flanges for installation of the pump system, measuring
equipment and gas inlet
-Vacuum Measuring Equipment: ZDR-1 105 to 10-1 Pa
thermal Priani vacuum gauge
-One sight window
-Roughing Pump Station
Roots pump: ZJP-2200
1 set
Piston pump: H-150
1 set
Rotary pump: 2X-70
1 set
3.2.0 On-line inspection room
-Room size: 3m x 4m x
-Fluorescent tubes: 21 pcs
3.2.1 Unloading station
-Steel frame and fixture, sizes 2500mm x3600mm
-Disk type roller transport system for linear movement of
substrate
3.2 Power Supply System
3.2.1 Voltage Requirement
-System operational voltage 3 x 380v, 50 Hz, 5-wire system
including loadable neutral and separate ground.
-Power requirement varies from 800KVA to 1000KVA depending on
the size of system and amount of installed components
3.2.2 Power control cabinets
There are two main control cabinets, each of which has a main
knife switch 600A
-Sputtering power control: 250A × 6
-Control system: 100A × 1
-Pumping system: 250A × 3
-Transport system: 200A ×
1
-Washing Unit: 250A×1
3.3
System and process control
WGC-1650/3 and its process are controlled by a series of
individual subassembly controllers. Subassembly control, sequential control and
system diagnostics are conducted by the system's central computer unit IPC610. Digital I/Os are controlled by the
Mitsubishi's A2AS series programmable controller (PLC) which
are slaved to the IPC610.
The WGC-1650/3 incorporates the advanced system and process
control available in the industry.
3.3.1 PC System Control
-The center computer use PC system, based
on an Intel Pentium microprocessor, being integrated as a sub-system in the
control cabinet.
-Windows 95, Windows 98 or Windows NT OS
system, GUI operation, easy to use
-Sequence control of different systems
-Parameter setting, modify,
store and recall
-Up to 15 to 20 sets of parameter can be
saved and recalled according to different process
-Data transfer and communication with the
Programmable Logic Controller
-Two 20" SVGA color monitors
-Process parameter changes can be entered
through an keyboard or a mouse.
-Data transfer and communication with the
system's Programmable Logic Controller
-Data storage capability on a External Memory Media
-Monitoring:
a.
Driving system.
The status of each driving unit will be shown on the screen. The
speed of the production line is controlled by Mitsubishi's frequency convertor
which is linked to IPC 601.
b.
Vacuum pumping system
The status of each
pumping unit, gate valve, vacuum valve, etc, will be monitor by the computer and display
on screen.
c.
Gas flow system
A mass proportion flow controller is applied.
d.
Alarm system
e.
Power supply system
Total power supply, washing machine power, cathode power supply,
etc.
f.
Other functions
Historical record, Tending analysis, Report printing, etc
3.3.2 Programmable Logic Controller
-Programmable logic controller (PLC) is built on a Mitsubishi
system, Model: A2AS which controls and processes all the digital and analog
I/Os of WGC-1650/3.
3.3.3 Auxiliary Control Devices
There are additional individual controllers distributed about
the system. These controllers operate independently but are triggered and
administered by the system's control. Most of the data is displayed at the
system's central monitor. The setting of the parameters can also be conducted/performed from the central monitor/keyboard. Some
examples of those individual controllers are:
Mass flow controllers
Transport speed control
Power supplies for sputtering
sources, etc.
3.3.4 Software
The operation of the system does not require any programming
language. The dialog is in simple English and the parameter entry is menu
driven by using a Microsoft windows environment. The standard software
includes:
-The standard software package, CITECT, is for the system
control and the basic process sequence such as:
Pump control and automatic valve sequencing
Parameters value display via the CRT
Logical sequence for glass sheet transport through the system
Process interlocks through basic parameters
Graphical display of selected process parameters, trend and
print out of actual values of process parameters required
Diagnostics and preventive maintenance routines:
Self diagnostic of the system and the interlocks on the board
level.
3.3.5 Menu
The menu for the operation of the system and the data recalling
is displayed on the color monitor. Always displayed are the status of the
system's utilities and the status of the sputtering sources (ON / OFF). More information will be
displayed for the individual modules or different features by selecting one of
the following sub-menus:
-Vacuum system
-Drive and gas supply system
-Parameter Entry
-Alarm List
-Set Time & Date
-Recipe Handling
-Process Constants
-Input & Output Listing
4. Documentation
A.
The documents in English
containing:
B.
Mechanical assembly drawings
and corresponding parts list.
C.
Pneumatic diagram
D.
Water piping / fluid diagram
E.
Electric circuit diagram
(also diagram/documentation of "standard parts")
F.
Wiring diagram
G.
Processor program
H.
Computer instruction manual
I.
List of recommend spare and
wear parts (mechanical. and electrical. )
J.
Parts list with numbers
K.
Operation manual
L.
Maintenance manual
Other engineering documents available on
request for interested customers
5. Acceptance Test
Testing at factory includes:
5.1
Test of Operation
-Checking of the equipment by means of the order
acknowledgement.
-Checking of the functions of the individual subassemblies such
as:
-Transport system
-Pumps and valves (pumping time)
-Power supplies
-Vacuum chamber
-Safety interlocks (water, electric current, pressure, faulty
operation)
-Function and working of the equipment in manual operation and
automatic operation.
-Two hours automatic continuous operation under conditions which
are similar to the production process. For
this test, target material, glass and substrate filtering will be supplied by
the buyer.
-Deposition uniformity
- ±3%
layer thickness uniformity across a sheet and from batch to batch within the
usable substrate area as per substrate dimensions.
-Measurement method: off-line Spectrophotometer.
5.2 Specification of targets to be supplied by the buyer.
Specification of Titanium, Chrome and Stainles